Substrate IC Package Design Engineer – Remote

About Syenta 

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation at significantly lower cost and energy use, while minimizing emissions and waste.

Founded in Australia, we are building a world-class team tackling some of the toughest challenges in semiconductor manufacturing. Our collaborative, people-first culture empowers individuals to take ownership, move quickly, and deliver meaningful impact.

About the Role 

This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches. 

Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform. 

This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology. 

Responsibilities 

Substrate & Interposer Design 

• Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements 
• Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk 
• Ensure robust signal integrity (SI) and power integrity (PI) across all designs 
• Optimize designs for thermal performance and reliability 

Design Validation & Documentation 

• Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs 
• Develop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development 

Cross-Functional Collaboration 

• Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance 
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints 

Technical Leadership & Development 

• Contribute to the establishment of internal best practices for substrate and interposer design 
• Provide expertise in advanced packaging design, helping build this capability within Syenta 

Requirements 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field 
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators 
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts 
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches 
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification) 
• Strong understanding of SI/PI principles and their application to package-level design 
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines 
• Working knowledge of substrate manufacturing processes, design rules, and material properties 
• Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment 

Preferred Qualifications 

• Familiarity with Valor CAM350 or Calibre for package design reviews 
• Experience designing for advanced packaging architectures (e.g. multi-chip modules, interposers, or similar high-density systems) 
• Experience working in high-growth or startup environments 

Why Choose Syenta? 

We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry. 

What We Offer 

• Salary Range: $130,000 – $180,000 + ESOP
• Hybrid work environment (Sydney-based)
• Flexible leave policies and strong work-life balance
• Opportunity to work closely with leadership and shape company direction
• Professional growth in a high-impact, fast-growing deep-tech startup